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SG2125 Series TGV Induction Post-Processing AOI Inspection Equipment
Classification:
AOI testing equipment
Keywords:
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Product Detail
Device Parameters
Device dimensions: Length × Width × Height: 2400 × 2100 × 2200 mm; does not include three‑color lights; weight: 2.5 tons.
Motion axis accuracy: XY absolute positioning accuracy ≤ 1.5 µm; Y repeat positioning accuracy ≤ 1 µm; XY straightness ≤ 5 µm
Platform movement speed: Adjustable from 0 to 300 mm/s
Loading and unloading method: Automatic loading and unloading, flipping, and automatic edge sealing and fastening.
Loading and unloading device: Can accommodate 1 standard Wafer FOUP and 1 Panel.
FOUP @ Manual Box Opening
Cleanliness: Class 100, equipped with FFUs and electrostatic ion wind bars for dust removal.
Vibration Level: VC-C, amplitude 12.5 µm/s
Temperature & Humidity: 23°C ± 5°C, 0%–75%
Power supply: AC 220V, 50Hz, 32A, 15kW
Vacuum pressure: -60 kPa to -90 kPa
Compressed air: 0.5–0.7 MPa
AOI Specifications
Test sample: TGV glass substrates, compatible with panel-level at 510mm*515mm and wafer-level at 6" and 8".
Material thickness: 0.1-1.5mm
CCD: Optical inspection resolution ≤ 1 µm, equipped with a real-time automatic focusing module.
Light source: Coaxial white light, with a grayscale difference of less than 10 across all areas in a single image.
Scanning Method: Non‑stop aerial photography
CT: 2 WPH @ ≤510 mm × 515 mm, 12 WPH @ 6 inches, 5 WPH @ 8 inches; Accuracy: >99%
Repetitive error: Single-chip yield repeatability error < ±0.3% @ each defect rate.
Machine difference: The yield difference for the same product across different machines must be less than ±0.3%.
File format: DXF format CAD
Device Features
EFEM: The pre-vacuum chamber is equipped with a material tray holder and uses a fully automatic robotic arm to load and unload wafers from the trays, featuring automatic transfer, alignment, and flipping capabilities.
Quick Changeover: Supports rapid recipe configuration, with product changeover time ≤ 10 minutes.
OCR: Features product ID scanning and the ability to link inspection data with IDs.
Calibration and Inspection: Support regular inspections of light source brightness and motion platform accuracy, as well as calibration of detection resolution.
Autofocus: Supports automatic image focusing.
Automatic Correction: The platform supports automatic product alignment and correction.
Automatic File Merging: Automatically refreshes and displays the mapping graph of inspection results, with customizable display colors for defect types.
Review and Re‑Judgment: You can view the test results and make corrections to them.
Offline Simulation: You can load offline images to view the current detection results and modify the detection parameters and thresholds.
Detection Card Control: You can set thresholds for test items to implement yield control functionality.
Communication Interface: Support for SECS/GEM reserved communication interfaces and automated handling equipment: Enables online data exchange with preceding laser-induced equipment, feeding defect via-hole data coordinates back to the laser repair equipment for secondary via-hole repair.
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No.866-4 Wuxian Road, Graphene New Material Industrial Park, Torch High-tech Zone, Xiamen, Fujian, China