Device Parameters
Device dimensions: Length * Width * Height: 2250 * 1950 * 2000 mm; does not include the three‑color lights; weight: 2.5 tons.

Cabinet dimensions: Length * Width * Height: 1000 * 600 * 2055 mm, Weight: 0.5 t

Motion axis accuracy: XY absolute positioning accuracy ≤ ±1 µm, XY repeat positioning accuracy ≤ 1 µm, XY straightness ≤ 5 µm @ XY axis effective travel > 750 mm × 920 mm

Loading and unloading method: Manual loading and unloading @ Compatible with optional automatic loading and unloading features

(Pending confirmation of the specific incoming material orientation and form)

Cleanliness: Class 100, equipped with FFUs and electrostatic ion wind bars for dust removal.

Vibration Level: VC-C, amplitude 12.5 µm/s

Temperature & Humidity: 20–24°C, RH = 45–55%

Power supply: AC 220V, 50Hz, 32A, 15kW

Vacuum pressure: -70 kPa to -90 kPa

AOI Specifications
Test sample: Through-hole glass inspection after TGV etching,

4 size specifications: 750*920mm and 550mm*650mm,

510mm*515mm, 370mm*470mm

Material thickness: 0.15-2mm

Detectable Process Stages: Post-etching inspection: @Hole diameter ≥ 20 µm, waist hole diameter ≥ 15 µm, number of holes ≤ 500,000, hole spacing > 50 µm, with substrate marks and cell marks.

Detectable Area: Can detect both the front and back sides as well as the waist hole @ Manual flipping

Testable Item 1: Poor through-hole leakage; output the coordinates of the leakage holes on the drawing.

Testable Item 2: Upper/lower surface aperture, waist hole diameter, true roundness of upper and lower holes,

Upper/Bottom Hole Concentricity and Hole Position Accuracy @ Calculated Based on Cell Mark

Detectable Item 3: Through-hole or foreign objects inside the hole?

Test Item 4: Surface dirt & scratches

Test Item 5: Product thickness @ customizable inspection points;

CCD: 21MP, 230fps area‑scan camera with a telecentric lens, equipped with a real‑time autofocus module; 5x magnification, 0.9 µm/pixel, capable of detecting defects with a minimum size of ≥3 pixels at 3 µm, with measurement tolerances of ±2 µm; configured with a thickness measurement module, achieving a detection accuracy of 1.5 µm.

Light source: Brightfield Coaxial White Light;

CT: 5X @ 36 min/pc; 750mm * 920mm, excluding loading/unloading and flipping.

Oversight and failure to prosecute: Leakage rate of 0, false alarm rate < 300 ppm;

GR&R: GR&R < 10% @ a dimensional tolerance of ±10 µm; GR&R < 20% @ a dimensional tolerance of ±5 µm.

Device Features
Quick Changeover: Supports rapid recipe configuration, with product changeover time ≤ 15 minutes.
Calibration and Inspection: Support regular inspections of light source brightness and motion platform accuracy, as well as calibration of detection resolution; Automatic correction: The stage supports automatic correction and alignment of products.
Automatic File Merging: Automatically refreshes and displays the mapping graph of detection results, with customizable display colors for defect types.
Review and Re‑Judgment: You can view the detection results and make corrections to them; Offline Simulation: You can load offline images to review the current detection performance and modify detection parameters and thresholds.

Mapping: It can be mapped with the inspection results from other processes in this series of equipment, used for closed-loop defect analysis and tracking, as well as for repair verification.

File format: DXF format CAD;